| 发明名称 |
COPPER ALLOY SPUTTERING TARGET |
| 摘要 |
A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu. |
| 申请公布号 |
US2015060269(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201414470074 |
申请日期 |
2014.08.27 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Mori Satoru;Sakamoto Toshio;Ookubo Kiyoyuki |
| 分类号 |
C23C14/34;C22C9/00 |
主分类号 |
C23C14/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A copper alloy sputtering target made of a copper alloy having a composition comprising Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities,
wherein Ca-segregated phases in which Ca is segregated are dispersed in a matrix phase, and the Ca-segregated phase contains Cu-dispersed phases made of Cu. |
| 地址 |
Tokyo JP |
