| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing board that reduce die-cutting defects when a contour is die-cut to break off a SIM card using a specific constitution board from a plate-like frame.SOLUTION: A card base material 100 is a base material including a white support layer 101 made of PET-G resin, and a layer 102 made of polymer alloy resin of polycarbonate and PET-G resin on the outer surface of the support layer. In a method for manufacturing a SIM card from the base material or a manufacturing board, as a solvent component for the outer surface base material layer, diacetone alcohol and diisobutyl alcohol are used as main solvent. After performing undercoat printing 111, 121 using silk screen ink including polyvinyl chloride-vinyl acetate-vinyl alcohol copolymer as a main resin component, offset pattern printing 112, 122 is performed and the SIM card is then die-cut by use of a die-cut blade die. |
