发明名称 |
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRING BOARD |
摘要 |
A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole. |
申请公布号 |
US2015062851(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201414469782 |
申请日期 |
2014.08.27 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIMIZU Noriyoshi;KANEDA Wataru;ARISAKA Hiromu;ROKUGAWA Akio |
分类号 |
H05K1/11;H05K1/09;H05K1/18;H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
1. A wiring board comprising:
a first insulating layer coating a first wiring layer; a first through hole that is opened in a surface of the first insulating layer and that exposes a surface of the first wiring layer; a first via arranged in the first through hole and including an end surface exposed to the surface of the first insulating layer, wherein a gap is formed between the first insulating layer and the first via in the first through hole; and a second wiring layer that is stacked on the surface of the first insulating layer and on the end surface of the first via and includes a pad, the pad filling the gap and being greater in planar shape than the first through hole. |
地址 |
Nagano-ken JP |