| 发明名称 |
HEAT TRANSFER FOR ELECTRONIC EQUIPMENT |
| 摘要 |
An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit. |
| 申请公布号 |
US2015062820(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314018189 |
申请日期 |
2013.09.04 |
| 申请人 |
Cisco Technology, Inc. |
发明人 |
Lam Mandy Hin;Huynh Hong Tran;Dogruoz M. Baris |
| 分类号 |
H01L23/473 |
主分类号 |
H01L23/473 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multiple integrated circuit heat distribution apparatus, comprising a planar heat conducting material that comprises:
a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink; a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink; and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit. |
| 地址 |
San Jose CA US |
