发明名称 |
METHOD OF PRODUCING SILICON CARBIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING SILICON CARBIDE SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor substrate and a silicon carbide semiconductor device which can suppress occurrence of step bunching effectively.SOLUTION: A method of producing a silicon carbide semiconductor substrate 10 includes steps of preparing a silicon carbide substrate 1 having a principal plane 1A and forming a silicon carbide epitaxial layer 5 on the principal plane 1A of the silicon carbide substrate 1 by using a raw material gas. In the step of forming the silicon carbide epitaxial layer 5, taking the ratio of the number of atoms of carbon contained in the raw material gas G divided by the number of atoms of silicon contained in the raw material gas as x and the growth temperature of the silicon carbide epitaxial layer 5 as y(°C), x and y fulfill the relationship: -250x+1830≤y≤-500x+2150 and 1≤x≤1.2. |
申请公布号 |
JP2015042602(A) |
申请公布日期 |
2015.03.05 |
申请号 |
JP20130174383 |
申请日期 |
2013.08.26 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
GENBAN JUN |
分类号 |
C30B29/36;C23C16/42;C30B25/16;H01L21/20;H01L21/205;H01L21/336;H01L29/12;H01L29/78 |
主分类号 |
C30B29/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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