发明名称 METHOD OF PRODUCING SILICON CARBIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING SILICON CARBIDE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a silicon carbide semiconductor substrate and a silicon carbide semiconductor device which can suppress occurrence of step bunching effectively.SOLUTION: A method of producing a silicon carbide semiconductor substrate 10 includes steps of preparing a silicon carbide substrate 1 having a principal plane 1A and forming a silicon carbide epitaxial layer 5 on the principal plane 1A of the silicon carbide substrate 1 by using a raw material gas. In the step of forming the silicon carbide epitaxial layer 5, taking the ratio of the number of atoms of carbon contained in the raw material gas G divided by the number of atoms of silicon contained in the raw material gas as x and the growth temperature of the silicon carbide epitaxial layer 5 as y(°C), x and y fulfill the relationship: -250x+1830≤y≤-500x+2150 and 1≤x≤1.2.
申请公布号 JP2015042602(A) 申请公布日期 2015.03.05
申请号 JP20130174383 申请日期 2013.08.26
申请人 SUMITOMO ELECTRIC IND LTD 发明人 GENBAN JUN
分类号 C30B29/36;C23C16/42;C30B25/16;H01L21/20;H01L21/205;H01L21/336;H01L29/12;H01L29/78 主分类号 C30B29/36
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