| 发明名称 |
LED MODULE |
| 摘要 |
An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant. |
| 申请公布号 |
US2015060935(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201414474767 |
申请日期 |
2014.09.02 |
| 申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHANG CHUNG-MIN;CHANG-CHIEN CHIEN-LIN;WU YA-TING;YANG ZHENG-HUA |
| 分类号 |
H01L33/52 |
主分类号 |
H01L33/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) module comprising:
a circuit board; a set of LED chips formed on and electrically connected to the circuit board; and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant. |
| 地址 |
Hsinchu Hsien TW |
