COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A combined printed wiring board includes a multilayer printed wiring board having an outermost insulation layer, and a wiring film fixed to a portion of the outermost insulation layer of the multilayer printed wiring board. The wiring film includes dense-pitch pads formed on a semiconductor-mounting surface of the wiring film, the multilayer printed wiring board has sparse-pitch pads formed on a semiconductor-mounting surface of the multilayer printed wiring board, the dense-pitch pads are formed to facilitate electrical connection between a first semiconductor element and a second semiconductor element, and the sparse-pitch pads are formed to facilitate electrical connection between the multilayer printed wiring board and the first semiconductor element and/or the second semiconductor element.

主权项

1. A combined printed wiring board, comprising:
a multilayer printed wiring board having an outermost insulation layer; and a wiring film fixed to a portion of the outermost insulation layer of the multilayer printed wiring board, wherein the wiring film includes a plurality of dense-pitch pads formed on a semiconductor-mounting surface of the wiring film, the multilayer printed wiring board has a plurality of sparse-pitch pads formed on a semiconductor-mounting surface of the multilayer printed wiring board, the plurality of dense-pitch pads is configured to facilitate electrical connection between a first semiconductor element and a second semiconductor element, and the plurality of sparse-pitch pads is configured to facilitate electrical connection between the multilayer printed wiring board and at least one of the first semiconductor element and the second semiconductor element.