| 发明名称 |
SUBSTRATE, METHOD OF FABRICATING THE SAME, AND APPLICATION THE SAME |
| 摘要 |
Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes. |
| 申请公布号 |
US2015061084(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201414472391 |
申请日期 |
2014.08.29 |
| 申请人 |
Industrial Technology Research Institute |
发明人 |
Tsai Yao-Jun;Hsu Chen-Peng;Wen Shih-Yi;Yang Chi-Chin;Hu Hung-Lieh |
| 分类号 |
H01L23/48;H01L29/866;H01L23/00;H01L33/20;H01L33/62;H01L21/768;H01L21/306;H01L27/02 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate, comprising:
a substrate material; two conductive structures, respectively extending from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material; and at least one diode, embedded in the substrate material at a sidewall of one of the through holes. |
| 地址 |
Hsinchu TW |
