发明名称 CORNER-CASE EMULATION TOOL FOR THERMAL POWER TESTING
摘要 <p>The various aspects provide for an IC design and methods for utilizing the IC design to emulate corner case ICs during power/thermal testing of a test system by installing a specially chosen IC on the test system. The chosen IC may be a fully functioning IC that also includes a leakage-add controller and a current leak circuit. The current leak circuit may simulate additional current leakage on the IC and may be driven by the leakage-add controller. The chosen IC may also include a programmable voltage table for adjusting the chosen IC's operational voltage. The chosen IC may emulate the thermal characteristics of various corner-case ICs while performing normal IC activities on the test system during power/thermal testing, thereby eliminating current limitations in thermal/power testing of test systems due to the difficulty of providing corner-case ICs and testing those corner-case ICs on various test systems.</p>
申请公布号 WO2015031172(A1) 申请公布日期 2015.03.05
申请号 WO2014US52196 申请日期 2014.08.21
申请人 QUALCOMM INCORPORATED 发明人 PARK, HEE-JUN
分类号 G01R31/317 主分类号 G01R31/317
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