发明名称 AIR BUBBLE REMOVAL APPARATUS, AIR BUBBLE REMOVAL METHOD, AND SEMICONDUCTOR MANUFACTURING APPARATUS CHEMICAL SUPPLY SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To provide an air bubble removal apparatus, an air bubble removal method, and a semiconductor manufacturing apparatus chemical supply system capable of effectively suppressing mixture of air bubbles.SOLUTION: According to an embodiment, an air bubble removal apparatus 1 includes: air bubble adsorption means; and air bubble discharge means. The air bubble adsorption means adsorbs air bubbles in a liquid within a container filled with the liquid. The air bubble discharge means captures the air bubbles adsorbed by the air bubble adsorption means. The air bubble discharge means discharges the captured air bubbles from the container. The air bubble adsorption means includes a mesh structure 11. The mesh structure 11 is such that linear members are combined into a lattice. The mesh structure 11 is configured to use the linear members including charged members that can be positively charged.</p>
申请公布号 JP2015042398(A) 申请公布日期 2015.03.05
申请号 JP20130174919 申请日期 2013.08.26
申请人 TOSHIBA CORP 发明人 MOTOOKA TAKASHI;MANABE ATSUYUKI
分类号 B01D19/00;B01D61/00;B01D63/02 主分类号 B01D19/00
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