ELECTRONIC ENDOSCOPE DEVICE, IMAGING MODULE, AND IMAGE PICK-UP LENS MOLDING METHOD

摘要

The invention provides an electronic endoscope device, an imaging module, and an image pick-up lens molding method that can prevented dew formation of an objective lens optical system and facilitate manufacture. An objective lens optical system of an imaging module includes a tip lens 50a in which a tip surface and a back surface are formed in a plane, and a recess S is formed; a plane plate 50b that block the recess S; and a lens barrel 51a that integrally molds and forms the entire outer peripheral surfaces of the tip lens 50a and the plane plate 50b with resin, while a state is maintained where the plane plate 50b is pressed against the tip lens 50a, and the plane plate 50b and the back surface of the tip lens 50a are directly brought into close contact with each other at an entire joining surface therebetween.

主权项

1. An imaging module comprising:
an objective lens optical system; and an imaging element that receives incident light that has entered through the objective lens optical system, wherein the objective lens optical system includes: a tip lens in which a tip surface that incident light enters and a back surface opposite to the tip surface are formed in a plane, and a recess that condenses the incident light is formed at a central portion of the back surface; a plane plate that is installed on a back side of the tip lens to block the recess; and a lens barrel that integrally molds and forms the entire outer peripheral surfaces of the tip lens and the plane plate with resin, while a state is maintained where the plane plate is pressed against the tip lens, and the plane plate and the back surface of the tip lens are directly brought into close contact with each other at an entire joining surface therebetween.