Packaged Semiconductor Device

摘要

A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid.

主权项

1. A packaged semiconductor device, comprising:
a semiconductor chip; an encapsulation material encapsulating the semiconductor chip, the encapsulation material comprising a first main face and a second main face opposite the first main face; first heat dissipation means disposed between the semiconductor chip and the first main face; second heat dissipation means disposed between the semiconductor chip and the second main face; and contact elements arranged on the second main face of the encapsulation material in such a way that the contact elements are enclosed by the encapsulation material and external surfaces of the contact elements are flush with the second main face of the encapsulation material, wherein the packaged semiconductor device is of non-rectangular cuboid shape.