BONDING SYSTEM

摘要

An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.

主权项

1. A bonding system configured to bond a first substrate to a second substrate, comprising:
a first processing station and a second processing station configured to perform a predetermined processing on the first substrate and the second substrate; and a carry-in/out station configured to carry the first substrate, the second substrate, and a superimposed substrate obtained by bonding the first substrate to the second substrate into/out of the first processing station, wherein the first processing station includes:
a first conveyance region configured to convey the first substrate, the second substrate and the superimposed substrate,a coating device disposed to be adjacent to the first conveyance region and configured to coat an adhesive on the first substrate,a heating device disposed to be adjacent to the first conveyance region and configured to heat the first substrate coated with the adhesive, and a first delivery block configured to deliver the first substrate, the second substrate and the superimposed substrate between the carry-in/out station and the first conveyance region, and the second processing station includes:
a plurality of bonding devices each of which is configured to bond the first substrate to the second substrate,a second conveyance region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices, anda second delivery block configured to deliver the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.