发明名称 |
POLYURETHANE POLISHING PAD |
摘要 |
The invention provides a polishing pad suitable for planarizing semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed from a prepolymer reaction of a polypropylene glycol and a toluene diisocyanate to form an isocyanate-terminated reaction product. The toluene diisocyanate has less than 5 weight percent aliphatic isocyanate; and the isocyanate-terminated reaction product having 5.55 to 5.85 weight percent unreacted NCO. The isocyanate-terminated reaction product being cured with a 4,4′-methylene-bis(3-chloro-2,6-diethylaniline) curative agent. The non-porous cured product having a tan delta of 0.04 to 0.10, a Young's modulus of 140 to 240 MPa and a Shore D hardness of 44 to 56. |
申请公布号 |
US2015059254(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
US201314017998 |
申请日期 |
2013.09.04 |
申请人 |
DOW GLOBAL TECHNOLOGIES LLC ;ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
Yeh Fengji;DeGroot Marty W.;Murnane James;James David B.;Kulp Mary Jo |
分类号 |
B24B37/24 |
主分类号 |
B24B37/24 |
代理机构 |
|
代理人 |
|
主权项 |
1. A polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates, the polishing pad comprising a cast polyurethane polymeric material formed from a prepolymer reaction of a polypropylene glycol and a toluene diisocyanate to form an isocyanate-terminated reaction product, the toluene diisocyanate having less than 5 weight percent aliphatic isocyanate and the isocyanate-terminated reaction product having 5.55 to 5.85 weight percent unreacted NCO, the isocyanate-terminated reaction product being cured with a 4,4′-methylene-bis(3-chloro-2,6-diethylaniline) curative agent, the cured polymer as measured in a non-porous state having a tan delta of 0.04 to 0.10 from 20 and 100° C. with a torsion fixture (ASTM 5279), a Young's modulus of 140 to 240 MPa at room temperature (ASTM-D412) and a Shore D hardness of 44 to 56 at room temperature (ASTM-D2240). |
地址 |
Midland MI US |