| 摘要 |
<p>To provide a wiring board applicable to micro-miniaturization of wiring, and a method for manufacturing the wiring board. A wiring board (1) is configured by laminating a resin insulating layer (20) and a conductor layer (33). The conductor layer (33) includes wiring (36) having a width equal to or less than 5μm, and the wiring (36) is formed on a resin insulating layer (20) surface having a maximum height (Rz) of less than 1.0μm.</p> |
