发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
摘要 <p>Disclosed is a plasma processing method including: growing a polycrystalline silicon layer on a processing target base body; and exposing the polycrystalline silicon layer to hydrogen radicals by supplying a processing gas containing hydrogen into a processing container that accommodates the processing target base body including the polycrystalline silicon layer grown thereon and radiating microwaves within the processing container to generate the hydrogen radicals.</p>
申请公布号 KR20150023504(A) 申请公布日期 2015.03.05
申请号 KR20147036571 申请日期 2013.04.17
申请人 TOKYO ELECTRON LIMITED 发明人 KATAYAMA DAISUKE;HONDA MINORU;NAKANISHI TOSHIO
分类号 H01L21/02;H01L21/223 主分类号 H01L21/02
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