| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device having a cooling function capable of being miniaturized and of improving the reliability required for productization and the productivity.SOLUTION: First power semiconductor elements 52 and 56 configuring an upper arm circuit, second power semiconductor elements 62 and 66 configuring a lower arm circuit, a first conductor plate 534 and a second conductor plate 584 arranged on one side and the other side of the first power semiconductor elements, and a third conductor plate 544 and a fourth conductor plate 574 arranged on one side and the other side of the second power semiconductor elements, are arranged so as to form a loop-like recovery current path, when a recovery current flows in the first conductor plate 534, the first power semiconductor elements 52 and 56, the second conductor plate 584, the third conductor plate 544, the second power semiconductor elements 62 and 66, and the fourth conductor plate 574, in this order. Eddy currents 605 and 606 are induced to a first heat radiation plate 522 and a second heat radiation plate 562 by the loop-like recovery current to reduce the inductance at switching operation. |
