| 发明名称 |
WIRE STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE WIRE STRUCTURE |
| 摘要 |
According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon. |
| 申请公布号 |
US2015061161(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201414467597 |
申请日期 |
2014.08.25 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
LEE Eun-kyung;CHOI Byoung-lyong;JOO Won-Jae;KIM Byung-Sung;LEE Jae-Hyun;LEE Jong-Woon;WHANG Dong-Mok |
| 分类号 |
H01L23/00;H01B5/00;H01B1/04 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wire structure comprising:
a first wire including a first wire core and a first carbon shell surrounding the first wire core, the first wire core having a wire shape, and the first carbon shell containing carbon; and a second wire that extends in a longitudinal direction from the first wire. |
| 地址 |
Suwon-Si KR |
