Three-Dimensional Chip Stack and Method of Forming the Same

摘要

A three-dimensional chip stack includes a first chip bonded to a second chip to form a bonded interconnection therebetween. The bonded interconnection includes a first conductive pillar overlying a first substrate of the first chip, a second conductive pillar overlying a second substrate of the second chip, and a joint structure between the first conductive pillar and the second conductive pillar. The joint structure includes a first IMC region adjacent to the first conductive pillar, a second IMC region adjacent to the second conductive pillar, and a metallization layer between the first IMC region and the second IMC region.

主权项

1. A three-dimensional chip stack, comprising:
a first chip comprising a first substrate; and a second chip comprising a second substrate; wherein the first chip is bonded to the second chip to form a bonded interconnection between the first substrate and the second substrate, wherein the bonded interconnection comprises a first conductive pillar overlying the first substrate, a second conductive pillar overlying the second substrate, and a joint structure between the first conductive pillar and the second conductive pillar; and wherein the joint structure comprises a first intermetallic compound (IMC) region adjacent to the first conductive pillar, a second IMC region adjacent to the second conductive pillar, and a metallization layer between the first IMC region and the second IMC region.