| 发明名称 |
SEQUENTIAL WAFER BONDING |
| 摘要 |
Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material. After attaching the second wafer, an opening (e.g., a trench cut) through the second wafer is formed, and an adhesive material is provided through the opening to further secure the second wafer to the sensor wafer. Embodiments of sensor devices formed using such methods include a first device cavity having a first pressure, and a second device cavity having a second pressure. |
| 申请公布号 |
US2015061044(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314011289 |
申请日期 |
2013.08.27 |
| 申请人 |
Bowles Philip H.;Hooper Stephen R. |
发明人 |
Bowles Philip H.;Hooper Stephen R. |
| 分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a sensor device, the method comprising:
attaching a first wafer to a sensor wafer with a first bond material; attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material; after attaching the second wafer, forming an opening through the second wafer; and providing an adhesive material through the opening to further secure the second wafer to the sensor wafer. |
| 地址 |
Gilbert AZ US |
