ASSEMBLY AND POWER-MODULE SUBSTRATE

摘要

This assembly is obtained by using a copper-phosphorus-tin brazing filler metal and a titanium material to join a ceramic member comprising a ceramic to a copper member comprising copper or a copper alloy. The following are formed at the join interface between the ceramic member and the copper member: a copper-tin layer, on the ceramic-member side, that comprises a solid solution of tin in copper; and a titanium layer between the copper member and the copper-tin layer. A first intermetallic layer comprising copper and titanium is formed between the copper member and the titanium layer, and a second intermetallic layer containing phosphorus is formed between the copper-tin layer and the titanium layer.