发明名称 |
SHEET FOR PROCESSING SEMICONDUCTOR |
摘要 |
A sheet (1) for processing a semiconductor, provided with a substrate (2) and an adhesive layer (3) laminated on at least one surface of the substrate, wherein the adhesive layer (3) is formed from an adhesive composition containing: a polymer having a salt and an energy ray-curable base, and an energy ray-curable adhesive component (excluding the noted polymer). According to the sheet (1) for processing a semiconductor, it is possible to inhibit pollution of an adherend during peeling after energy ray irradiation while also demonstrating sufficient antistatic properties. |
申请公布号 |
WO2015030186(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
WO2014JP72765 |
申请日期 |
2014.08.29 |
申请人 |
LINTEC CORPORATION |
发明人 |
YAMASHITA, SHIGEYUKI;SATO, AKINORI |
分类号 |
C09J7/02;C09J9/02;C09J11/06;C09J133/00;H01L21/301;H01L21/304 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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