Provided is a susceptor capable of improving thermal uniformity while suppressing reduction in temperature increase speed and heat utilization efficiency in the susceptor. The susceptor (100) comprises: a plate-shaped first member (10) having a wafer arrangement surface on which wafers are arranged; and a second member (20) supporting the first member (10) and laminated upon the first member (10) in a direction orthogonal to the wafer arrangement surface. The thermal conductivity of the first member (10) is higher than the thermal conductivity of the second member (20).
