发明名称 |
ETCHING METHOD, AND RECORDING MEDIUM |
摘要 |
This etching method has: a transforming step in which a mixed gas is supplied to the surface of a silicon oxide film, and the silicon oxide film is transformed to generate a reaction product; and a heating step in which the reaction product is heated and removed. The transforming step has a first transforming step in which a mixed gas containing a basic gas and a halogen-containing gas is supplied to the surface of the silicon oxide film, and a second transformation step in which the supply of the basic gas is stopped and a mixed gas containing the halogen-containing gas is supplied to the surface of the silicon oxide film. |
申请公布号 |
WO2014208365(A3) |
申请公布日期 |
2015.03.05 |
申请号 |
WO2014JP65736 |
申请日期 |
2014.06.13 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TOZAWA, SHIGEKI;OGIWARA, TOMOAKI |
分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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