发明名称 ETCHING METHOD, AND RECORDING MEDIUM
摘要 This etching method has: a transforming step in which a mixed gas is supplied to the surface of a silicon oxide film, and the silicon oxide film is transformed to generate a reaction product; and a heating step in which the reaction product is heated and removed. The transforming step has a first transforming step in which a mixed gas containing a basic gas and a halogen-containing gas is supplied to the surface of the silicon oxide film, and a second transformation step in which the supply of the basic gas is stopped and a mixed gas containing the halogen-containing gas is supplied to the surface of the silicon oxide film.
申请公布号 WO2014208365(A3) 申请公布日期 2015.03.05
申请号 WO2014JP65736 申请日期 2014.06.13
申请人 TOKYO ELECTRON LIMITED 发明人 TOZAWA, SHIGEKI;OGIWARA, TOMOAKI
分类号 H01L21/302 主分类号 H01L21/302
代理机构 代理人
主权项
地址