发明名称 |
SCRATCH FILTER FOR WAFER INSPECTION |
摘要 |
Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer. |
申请公布号 |
WO2015031397(A1) |
申请公布日期 |
2015.03.05 |
申请号 |
WO2014US52758 |
申请日期 |
2014.08.26 |
申请人 |
KLA-TENCOR CORPORATION |
发明人 |
HUANG, JUNQING;JIN, HUAN;CHEN, GRACE HSIU-LING;GAO, LISHENG |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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