BONDING APPARATUS , BONDING METHOD, AND METHOD FOR MANUFACTURING SUBSTRATES

摘要

Provided is a bonding method. The bonding method is to bond a first electrical connection member to a second electrical connection member in a processing substrate having a first unit having the first electrical connection member, and a second unit having the second electrical connection member and a bonding member to surround the second electrical connection member. The bonding method includes a first melting step to melt the bonding member, a curing step of cure the fused bonding member, and a second melting step to melt the second electrical connection member in the state that the bonding member is cured.