METAL SUBSTRATE AND LIGHT SOURCE DEVICE

摘要

To provide a metal substrate and a light source device, ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, and heat generated in the semiconductor chip mounted can be efficiently dissipated through a metal plate. A metal substrate 100 having a light source mounting surface for mounting a semiconductor chip working as a light source, comprising a heat dissipating metal plate 111 comprising a metal except for Au, an insulating resin-made white film 120 stacked on a part of the heat dissipating metal plate 11, and a light source mounting surface-forming layer 114 stacked on another part of the heat dissipating metal plate 111, wherein the light source mounting surface-forming layer 114 is a metal layer directly contacting with the heat dissipating metal plate and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.