发明名称 |
SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD |
摘要 |
<p>A semiconductor component having a light-emitting semiconductor layer or a light-emitting semiconductor element, two contact locations and a vertically or horizontally patterned carrier substrate, and a method for producing a semiconductor component are disclosed for the purpose of reducing or compensating for the thermal stresses in the component. The thermal stresses arise as a result of temperature changes during processing and during operation and on account of the different expansion coefficients of the semiconductor and carrier substrate. The carrier substrate is patterned in such a way that the thermal stresses are reduced or compensated for sufficiently to ensure that the component does not fail.</p> |
申请公布号 |
EP1547162(B1) |
申请公布日期 |
2015.03.04 |
申请号 |
EP20030750322 |
申请日期 |
2003.09.05 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
EISERT, DOMINIK;ILLEK, STEFAN;SCHMID, WOLFGANG |
分类号 |
H01L33/00;H01L33/20 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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