发明名称 半導体装置およびその製造方法
摘要 <p>A semiconductor device includes a HEMT and a diode. The HEMT includes: a substrate having a GaN layer as a channel layer generating a two-dimensional electron gas and an AlGaN layer as a barrier layer on the GaN layer; a source electrode on the AlGaN layer ohmic contacting the AlGaN layer; a drain electrode on the AlGaN layer apart from the source electrode and ohmic contacting the AlGaN layer; an inter-layer insulating film on the AlGaN layer between the source electrode and the drain electrode; and a gate electrode on the inter-layer insulating film. The substrate includes an active layer region generating the two dimensional electron gas in the GaN layer. The diode includes an anode electrically connected to the gate electrode and a cathode electrically connected to the drain electrode.</p>
申请公布号 JP5678866(B2) 申请公布日期 2015.03.04
申请号 JP20110239044 申请日期 2011.10.31
申请人 发明人
分类号 H01L21/337;H01L21/28;H01L21/336;H01L21/338;H01L21/822;H01L21/8232;H01L27/04;H01L27/06;H01L29/41;H01L29/417;H01L29/778;H01L29/78;H01L29/808;H01L29/812;H01L29/861;H01L29/868 主分类号 H01L21/337
代理机构 代理人
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