| 摘要 |
<p>The present invention relates to a semiconductor device which obtains a heat dissipation effect and prevents a warpage phenomenon while performing a carrier function in a semiconductor package manufacturing process which electrically connects a semiconductor chip to a substrate by a medium of an interposer at the same time, and a method for manufacturing the same. For this, the present invention includes an interposer having through silicon vias; upper stack chips which are electrically connected to the though silicon via by a medium of a second conductive connection body and are stacked on one surface of the interposer; a molding compound resin which is molded on one surface of the interpose and surrounds the lateral part of the upper stack chip; a carrier-convertible heat spreader which is bonded onto the molding compound resin and the upper stack chip which are on the same plane; a substrate to which an interposer having the stacked upper stack chip is bonded by a medium of a first conductive connection body.</p> |
