| 摘要 |
<p>The present invention relates to a method for contactless measuring the waviness (Wa) of a moving surface, based on the use of a microscope sensor, using a surface minimal profile length defined by two cut-off frequency values, a low cut-off and a high cut-off, comprising the steps of: - grabbing at high frequency, by means of a high speed camera, a plurality of individual images of the surface with a side overlapping, said images being obtained by means of a high resolution triangulation method in which, for each image, under an illumination background, a profile of the surface is estimated by the analysis of the deformation of a laser line projected on the surface at a given angle, said projected line being essentially parallel to the direction of movement ;
- stitching said plurality of images together to obtain a stitched image corresponding to a profile having a length of at least said minimal profile length ; and
- filtering said profile by analysis of the stitched image.</p> |
