| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving molded products excellent in moldability, high in thermal conductivity, and low in thermal expansion, and excellent in heat resistance and moisture resistance; and to provide molded products using the same. <P>SOLUTION: This epoxy resin composition includes an epoxy resin and a curing agent as principal components, where an epoxy resin having a mesogenic group of a structure having a bisphenylene unit or naphthylene unit is used by 50 wt.% or more in the epoxy resin component as the epoxy resin component, and bifunctional phenolic compound is 75 wt.% or more in the curing agent component as the curing agent component. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
