Wire saw device

摘要

A wire saw device for cutting semiconductor material is described. The wire saw device includes a tension modifier adapted to convert a first wire tension into a second wire tension. The tension modifier includes a first guide roller including an axis of rotation and a plurality of grooves being formed in an outer circumferential surface of the first guide roller and a second guide roller including a plurality of grooves being formed in an outer circumferential surface of the second guide roller. The first guide roller and the second guide roller are spaced apart from each other at a fixed distance. The second guide roller is pivotable around the axis of rotation of the first guide roller.