| 摘要 |
<p>Provided is a substrate treating apparatus. The substrate treating apparatus includes a housing, a transfer unit which is located in the housing and transfers a substrate, a nozzle unit which injects liquid onto the substrate placed on the transfer unit, and a liquid supply unit which supplies the liquid to the nozzle unit. The liquid supply unit may include a liquid tank, a supply line which connect the liquid tank and the nozzle unit and supplies the nozzle unit, a collection line which collects the liquid and store it in the liquid tank to collect and reuse the liquid after the process, and a controller which differently controls the amount of the liquid supplied to the substrate by a set purchase unit.</p> |
