| 摘要 |
The present invention relates to a sapphire, a mobile phone, a watch, a terminal, and a wafer. If the surface of the sapphire is cut into diamond wire saws in order to prevent the waste of the material, there is no the waste of the material and a processing time can be shorten, thereby enabling to save costs. According to the present invention, a method for cutting a sapphire curved surface window comprises: smoothening a curved cut surface by surface cutting-polishing on the sapphire with an external angle processed in the diamond wire saws; repeating the surface cutting-polishing step in the diamond wire saws again; and producing a product by polishing an external surface in the second step after producing semimanufactured goods with a complete inner surface. |
