| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows defective portions to be easily identified, to provide a method of forming the same, and to provide a method of designing the same. <P>SOLUTION: A semiconductor device comprises a wiring pattern 32a, a dummy pattern 32b, and a fuse 32c in which a first end is electrically connected to the wiring pattern and a second end is electrically connected to the dummy pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
