A curable epoxy adhesive composition including (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) at least a first hydrophilic filler that has a predetermined aspect ratio; (e) at least a second hydrophobic filler that is different from the first filler and that has a predetermined aspect ratio; and (f) at least a third filler that is different from the first and second fillers; wherein the third filler has a predetermined aspect ratio higher than the first filler and the second filer; and wherein the volume ratio of the third filler to the combination of the first filler and second filler is in the range of from 1:1 to 10:1 such as to minimize the thermal residual stresses of the cured product made from the curable composition.
申请公布号
EP2841521(A1)
申请公布日期
2015.03.04
申请号
EP20130716686
申请日期
2013.04.03
申请人
DOW GLOBAL TECHNOLOGIES LLC
发明人
BALIJEPALLI, BHARATI;THEOFANOUS, THEOFANIS;HOEVEL, BERND;VERGHESE, KANDATHIL, E.;PHAM, HA, Q.