发明名称 |
Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound |
摘要 |
<p>An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.</p> |
申请公布号 |
EP2662395(A3) |
申请公布日期 |
2015.03.04 |
申请号 |
EP20130165059 |
申请日期 |
2013.04.24 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
PARK, JAE MAN;KIM, HAE YEON;MOON, SUNGBAE;PARK, JEUNGOOK;YUN, SUNGJIN;YOON, JONGHEUM;LEE, HYUK SOO;JEONG, JAEHUN;CHO, IN HEE |
分类号 |
C08G59/28;C07D303/46;C08L63/00;H05K1/05 |
主分类号 |
C08G59/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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