发明名称 プリント基板積層体およびその製造方法
摘要 <p>The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board.</p>
申请公布号 JP5679333(B2) 申请公布日期 2015.03.04
申请号 JP20110185598 申请日期 2011.08.29
申请人 发明人
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
代理机构 代理人
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