发明名称 LEDモジュール
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED module which is excellent in repair property and assemblability, and can be made thin and inexpensive. <P>SOLUTION: An LED module comprises: an LED member 4 in which an LED part 3 is provided on a substrate 2 and a pair of LED side electrode parts electrically connected to the LED part 3 is provided on the substrate 2; a heat sink member 5 in which the LED member 4 is arranged on its upper surface; a base plate 6 arranged on the heat sink member 5 and having a pair of base side electrode parts adjacent to the LED member 4, provided on its upper surface; and a transparent cover member 7 covering the LED member 4 and provided on the base plate 6. The transparent cover member 7 comprises a pair of conductive spring members 8 inside which contacts with the LED side electrode parts and the base side electrode parts corresponding to each other at both edges in an energization state and in state that the base plate 6 is installed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5679897(B2) 申请公布日期 2015.03.04
申请号 JP20110102810 申请日期 2011.05.02
申请人 シチズン電子株式会社;シチズンホールディングス株式会社 发明人 渡辺 正志
分类号 H01L33/00 主分类号 H01L33/00
代理机构 代理人
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