发明名称 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, INSULATING FILM, COLOR FILTER, AND DISPLAY DEVICE
摘要 Provided are: a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the negative-type photosensitive resin composition; a cured film, an insulating film, and a color filter formed using the negative-type photosensitive resin composition; and a display device provided with the cured film, insulating film, or color filter. The negative-type photosensitive resin composition according to the present invention contains a compound represented by the following formula (1). In the formula, R 1 and R 2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R 1 and R 2 may be bonded to form a ring structure and may contain a hetero atom bond. R 3 indicates a single bond or an organic group. R 4 to R 9 each independently indicate a hydrogen atom, an organic group, etc., but R 6 and R 7 are never hydroxyl groups. R 10 indicates a hydrogen atom or an organic group.
申请公布号 EP2725423(A4) 申请公布日期 2015.03.04
申请号 EP20120803395 申请日期 2012.06.15
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SHIOTA, DAI;KUROKO, MAYUMI;NODA, KUNIHIRO;TADOKORO, YOSHINORI
分类号 G03F7/085;G02B5/20;G03F7/004;G03F7/032 主分类号 G03F7/085
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