发明名称 Optoelectronic semiconductor chip and method for the production thereof
摘要 An optoelectronic semiconductor chip includes a semiconductor layer stack having an active layer that generates radiation, and a radiation emission side, and a conversion layer disposed on the radiation emission side of the semiconductor layer stack, wherein the conversion layer converts at least a portion of the radiation, which is emitted by the active layer, into radiation of a different wavelength, the radiation emission side of the semiconductor layer stack has a first nanostructuring, and the conversion layer is disposed in this first nanostructuring.
申请公布号 US8969900(B2) 申请公布日期 2015.03.03
申请号 US201113883346 申请日期 2011.11.02
申请人 OSRAM Opto Semiconductors GmbH 发明人 Sabathil Matthias;Linkov Alexander;Kölper Christopher;Straβburg Martin;von Malm Norwin
分类号 H01L29/22;H01L33/02;H01L33/20;H01L33/50;H01L33/08;H01L33/24;B82Y40/00 主分类号 H01L29/22
代理机构 DLA Piper LLP (US) 代理人 DLA Piper LLP (US)
主权项 1. An optoelectronic semiconductor chip comprising: a semiconductor layer stack having an active layer that generates radiation, and a radiation emission side, and a conversion layer disposed on the radiation emission side the semiconductor layer stack, wherein the conversion layer converts at least a portion of the radiation, which is emitted by the active layer, into radiation of a different wavelength, the radiation emission side of the semiconductor layer stack has a first nanostructuring, the conversion layer is only disposed in the first nanostructuring so that a top side of the nanostructuring is free of the conversion layer and so that the nanostructuring is completely filled with the conversion layer, wherein the first nanostructuring is composed of a plurality of nanorods and recesses and the top side is a side remote from a continuous layer of the semiconductor layer stack, and the active layer only covers all lateral surfaces and base surfaces of the recesses so that the top side of the nanostructuring is free of the active layer.
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