| 发明名称 | Electrochemical processor alignment system | ||
| 摘要 | A substrate plating processor has a vessel on a support structure and a head support fixed in place relative to the support structure. A head having a rotor is attached to the head support. A lifter associated with the head support moves the head into and out of engagement with the vessel. An alignment assembly attachable to the rotor has at least one sensor adapted to detect a position of an inside surface of the vessel when the head is engaged with the vessel. The sensor may be a physical contact sensor positioned to contact the inside surface of the vessel. | ||
| 申请公布号 | US8968532(B2) | 申请公布日期 | 2015.03.03 |
| 申请号 | US201113267693 | 申请日期 | 2011.10.06 |
| 申请人 | APPLIED Materials, Inc. | 发明人 | Puch Bryan |
| 分类号 | C25D17/00;H01L21/67;H01L21/68 | 主分类号 | C25D17/00 |
| 代理机构 | Perkins Coie LLP | 代理人 | Ohriner Kenneth H.;Perkins Coie LLP |
| 主权项 | 1. A substrate plating processor, comprising: a vessel on a support structure; a head support fixed in place relative to the support structure; a head attached to the head support; a lifter associated with the head support for moving the head into and out of engagement with the vessel; a rotor on the head rotatable about a rotor axis; and an alignment assembly attachable to the rotor, with the alignment assembly having at least one physical contact sensor in physical contact with an inside surface of the vessel as the rotor rotates and adapted to detect a position of the inside surface of the vessel relative to the rotor axis, when the head is engaged with the vessel. | ||
| 地址 | Santa Clara CA US | ||