Method for manufacturing piezoelectric actuator

摘要

In sputter etching to improve the adhesion between upper electrodes and lead electrodes, the sputter etching of surfaces of the upper electrodes under an Ar gas flow at a flow rate of 60 sccm or more can reduce the residence time of Ar ions on the surfaces of the upper electrodes because of the Ar gas flow. This can prevent the charging of the upper electrodes due to the buildup of ionized Ar gas on the surfaces, reduce the influence of charging on piezoelectric elements, and provide a method for manufacturing a piezoelectric actuator that includes the piezoelectric elements each including a piezoelectric layer having small variations in hysteresis characteristics and deformation characteristics.

主权项

1. A method for manufacturing a piezoelectric actuator, comprising:
forming a diaphragm on a substrate; forming piezoelectric elements on the diaphragm, the piezoelectric elements including individual electrodes and piezoelectric layers; after the individual electrodes are formed, sputter-etching surfaces of the individual electrodes under an Ar gas flow at a flow rate in the range of 60 to 80 sccm; and forming lead electrodes on the surfaces of the individual electrodes.