Interconnect structure for MEMS device

摘要

An interferometric modulator array is formed with connectors and/or an encapsulation layer with electrical connections. The encapsulation layer hermetically seals the array. Circuitry may also be formed over the array.

主权项

1. A method of manufacturing a display device, comprising:
providing a transmissive substrate; forming a plurality of individually addressable interferometric light modulators on the substrate, wherein forming each of the interferometric light modulators includes forming a partially reflective optical stack on the substrate, the optical stack including a first electrode; depositing a sacrificial layer over the optical stack; forming a reflective layer over the sacrificial layer, the reflective layer including a second electrode; removing the sacrificial layer to form an interferometric cavity between the optical stack and the reflective layer, wherein upon removing the sacrificial layer the reflective layer becomes movable through the cavity such that the reflective layer can be moved to an actuated position and to an unactuated position based on a voltage applied between the optical stack and reflective layer; forming a conductive interconnect layer over the reflective layer and electrically connected to a portion of the reflective layer; forming active circuitry including at least one of a diode, a transistor, and a zener diode connected to the interconnect layer; and forming a conductive connector connected on one end to the active circuitry and configured to connect to an external device to control said modulator through said connector, wherein the active circuitry is connected to the connector and disposed between the interconnect and the connector.