Electrostatic chuck with temperature control

摘要

Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.

主权项

1. Apparatus for controlling a temperature of an electrostatic chuck in a process chamber, comprising:
an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface; and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust a cooling capacity of the electrostatic chuck, wherein the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an annular outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck, and wherein the inner cooling plate is disposed within a central opening of the annular outer cooling plate.