Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle pad and a peripheral lead pad with an inner lead pad between the die attach paddle pad and the peripheral lead pad; forming a component side of the lead frame for exposing an upper portion of a peripheral lead under the peripheral lead pad; forming an encapsulation on the lead frame and the upper portion of the peripheral lead; exposing the peripheral lead pad; depositing a conductive shielding layer on the encapsulation connected to the peripheral lead pad; and forming a mounting side of the lead frame for forming a lower portion of the peripheral lead over a peripheral lead contact pad.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a die attach paddle pad and a peripheral lead pad with an inner lead pad between the die attach paddle pad and the peripheral lead pad; forming a component side of the lead frame for exposing an upper portion of a peripheral lead under the peripheral lead pad; forming an encapsulation on the lead frame and the upper portion of the peripheral lead, the encapsulation completely covering a top surface of the peripheral lead pad; exposing the top surface of the peripheral lead pad from the encapsulation; depositing a conductive shielding layer over the top surface of the peripheral lead pad and on the encapsulation connected to the peripheral lead pad; forming a mounting side of the lead frame for forming a lower portion of the peripheral lead over a peripheral lead contact pad; and singulating the peripheral lead and the peripheral lead pad for forming an exposed lateral pad surface, a portion of the peripheral lead pad exposed from the conductive shielding layer and coplanar to a lateral surface of the conductive shielding layer.