发明名称 Light emitting device module and lighting system including the same
摘要 Disclosed herein is a light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one light emitting diode electrically connected to the first conductive layer and second conductive layer, the at least one light emitting device is thermally contacted to an exposed portion of the heat transfer member, wherein the heat transfer member has an exposed portion disposed within the cavity between the first conductive layer and the second conductive layer.
申请公布号 US8969885(B2) 申请公布日期 2015.03.03
申请号 US201113242140 申请日期 2011.09.23
申请人 LG Innotek Co., Ltd. 发明人 Lee Gun Kyo;Oh Nam Seok;Ryu Young Hun
分类号 H01L33/00;H01L33/64;H01L33/48;H01L33/62;H05K1/18 主分类号 H01L33/00
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A light emitting device module, comprising: a heat transfer member that defines a cavity having a bottom and a side wall; a first conductive layer and a second conductive layer each contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member, wherein at least one of the first conductive layer and the second conductive layer includes at least one cut-out portion, an entire circumference of the at least one cut-out portion being surrounded by the first conductive layer or the second conductive layer; and at least one light emitting diode electrically connected to the first conductive layer and second conductive layer, wherein the at least one light emitting diode thermally contacts an exposed portion of the heat transfer member, wherein the exposed portion of the heat transfer member is disposed within the cavity between the first conductive layer and the second conductive layer, and wherein a thickness of the heat transfer member at the bottom of the cavity is the same as a thickness of the heat transfer member at an outside of the cavity, and wherein at least one of the first conductive layer or the second conductive layer extends from an edge of the cavity to the side wall of the cavity and then to a portion of the bottom of the cavity, wherein the at least one light emitting diode is disposed on the bottom of the cavity.
地址 Seoul KR