发明名称 Double patterning via triangular shaped sidewall spacers
摘要 An intermediate semiconductor structure in fabrication includes a silicon semiconductor substrate, a hard mask of silicon nitride (SiN) over the substrate and a sacrificial layer of polysilicon or amorphous silicon over the hard mask. The sacrificial layer is patterned into sidewall spacers for mandrels of a filler material substantially different in composition from the sidewall spacers, such as a flowable oxide. The mandrels are removed such that the sidewall spacers have vertically tapered inner and outer sidewalls providing a rough triangular shape. The rough triangular sidewall spacers are used as a hard mask to pattern the SiN hard mask below.
申请公布号 US8969205(B2) 申请公布日期 2015.03.03
申请号 US201313852496 申请日期 2013.03.28
申请人 发明人 Shen HongLiang;Choi Dae-Han;Yang Dae Geun;Hsieh Jung Yu
分类号 H01L21/311;H01L21/02;H01L29/423;H01L29/78 主分类号 H01L21/311
代理机构 Heslin Rothenberg Farley & Mesiti P.C. 代理人 Reinke, Esq. Wayne F.;Heslin Rothenberg Farley & Mesiti P.C.
主权项 1. A method, comprising: providing an intermediate semiconductor structure, the structure comprising a semiconductor substrate and a sacrificial layer of a dummy gate material above the substrate; and creating sidewall spacers in the sacrificial layer, the creating comprising vertically tapering inner and outer sidewalls, such that the sidewall spacers have a rough triangular shape with a pointed tip.
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