发明名称 |
Double patterning via triangular shaped sidewall spacers |
摘要 |
An intermediate semiconductor structure in fabrication includes a silicon semiconductor substrate, a hard mask of silicon nitride (SiN) over the substrate and a sacrificial layer of polysilicon or amorphous silicon over the hard mask. The sacrificial layer is patterned into sidewall spacers for mandrels of a filler material substantially different in composition from the sidewall spacers, such as a flowable oxide. The mandrels are removed such that the sidewall spacers have vertically tapered inner and outer sidewalls providing a rough triangular shape. The rough triangular sidewall spacers are used as a hard mask to pattern the SiN hard mask below. |
申请公布号 |
US8969205(B2) |
申请公布日期 |
2015.03.03 |
申请号 |
US201313852496 |
申请日期 |
2013.03.28 |
申请人 |
|
发明人 |
Shen HongLiang;Choi Dae-Han;Yang Dae Geun;Hsieh Jung Yu |
分类号 |
H01L21/311;H01L21/02;H01L29/423;H01L29/78 |
主分类号 |
H01L21/311 |
代理机构 |
Heslin Rothenberg Farley & Mesiti P.C. |
代理人 |
Reinke, Esq. Wayne F.;Heslin Rothenberg Farley & Mesiti P.C. |
主权项 |
1. A method, comprising:
providing an intermediate semiconductor structure, the structure comprising a semiconductor substrate and a sacrificial layer of a dummy gate material above the substrate; and creating sidewall spacers in the sacrificial layer, the creating comprising vertically tapering inner and outer sidewalls, such that the sidewall spacers have a rough triangular shape with a pointed tip. |
地址 |
|