| 发明名称 | Solder flow-impeding plug on a lead frame | ||
| 摘要 | Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as first partial etch forming a trench. A non-conductive material that is adhesive to the lead frame is applied in the trench, such that the non-conductive material extends across the trench to form the solder flow-impeding plug. One or more components are attached to the internal surface of the lead frame and encapsulated. An external surface of the lead frame is etched at the dividing lines to disconnect different sections of lead frame as a second partial etch. | ||
| 申请公布号 | US8969137(B2) | 申请公布日期 | 2015.03.03 |
| 申请号 | US201213716956 | 申请日期 | 2012.12.17 |
| 申请人 | Intersil Americas LLC | 发明人 | Cruz Randolph;Carpenter, Jr. Loyde M. |
| 分类号 | H01L21/00;H01L23/495;H01L21/56;H01L21/48 | 主分类号 | H01L21/00 |
| 代理机构 | Fogg & Powers LLC | 代理人 | Fogg & Powers LLC |
| 主权项 | 1. A method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame, the method comprising: partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as a first partial etch forming a trench; applying a non-conductive material that is adhesive to the lead frame in the trench, such that the non-conductive material overlaps the internal surface of the lead frame adjacent the trench on at least one side to form the solder flow-impeding plug; attaching one or more components to the internal surface of the lead frame; encapsulating the one or more components and the lead frame; and partially etching an external surface of the lead frame at the dividing lines to disconnect different sections of lead frame as a second partial etch. | ||
| 地址 | Milpitas CA US | ||